The feild of Semiconductor:Dicing of Si/SiC wafers,Low-K grooving, Dicing of MEMS/RFID/SIM-card chip wafers,Micro-drilling of wafers,Marking of wafers,ect.
The feild of smart terminal: Touch screens; Fingerprint ID and camera modules; Smartphone display covers; Cutting of ceramic smartphone frames/back covers, etc.
The feild of advanced displays: Cutting of full screen chamfering. Cutting of flexible OLED, Cutting of double-layer glass modules, Cutting of flexible modules, etc.
The feild of scientific Research:Cutting/drilling of large-diameter/deep holes, Surface treatment or micro-structuring of any material, Customized process development, etc.
Automatic Screen Glass Chamfer Laser Processing System - AGC20
Automatic Screen Glass Chamfer Laser Processing System - AGC10
Automatic Polarizer Laser Cutting System—CLPC65
Full-automatic Flexible OLED Modules Laser Cutting System
Vehicle-mounted LENS/G-Sensor/OGS Integrated Cutting and Drilling Solution
Laser-Induced Dicing System for Silicon Carbide Wafers
Laser-Induced Wafer Dicing System
Five-Axis Laser Micromachining System
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